◪ Surface matte, high contrast
◪ Surface luminescent technology - turning point into surface to solve the problem of LED glare
◪ Low pin technology - high cup and low feet, easy for customers to glue, cover the mask
Features:
1) Gold wireless: no gold wire, led failure rate drop 90%, high stability.
2) Alloy welding method, dead light possibility falling by 90%.
3) Aluminum Nitride substrate instead of copper substrate, separation of heat and electricity conductivity and
higher thermal conductivity.
4) Small lighting area, high luminous density.
5) Patented phosphor recipe, stable color temperature and no drifting.
6) Equipped with temperature sensor, precise temperature control.
7) Easy to install with a straight plug.
8) Easy to keep the lighting surface clean with anti-dust design.
Strong R & D Forces
* A strong R & D team of more than 40 experienced engineers.
* CNAS Accredited Laboratory.
* Launch highly-competitive new products seasonly.
* Revolutionary launch for a full series of high power & high integration ceramic flip chip led.
Specification:
Product Name Flip Chip COB Module | Power | Viewing Angle | LES | CCT | Voltage | Current | Luminous Flux |
(GT-FC60) | 60W | 120 ° Flip Chip | 6.66*6.66mm | 6000-6500K 8000-9000K | 14-18V | 3.75A | 5000-5500LM |
(GT-FC90) | 90W | 6.66*6.66mm | 5.5A | 6000-6500LM | |||
(GT-FC150) | 150W | 9.64*9.64mm | 21-24V | 6.7A | 11000-12000LM | ||
(GT-FC300) | 300W | 13.48*13.48mm | 30-36V | 9.3A | 20000-22000LM | ||
(GT-FC500) | 500W | 12.84*12.84mm | 30-36V | 15.5A | 30000-35000LM |
Our Service:
PCB design & Reflow soldering service
COB/LED/Drivers customization
Mold development (Plastic injection & Die casting)
Representatives in the UK, Korea and Czech.
* ISO9001-2008, SGS, TUV, BV, CNAS accredited laboratory & Optical Lab.
Copyright © 2019 Zhongshan Tranch Optoelectronics Techonlogy Co.,Ltd. | All Rights Reserved
Nice to meet you!We will reply to your message as soon as we receive it. E-mail:yw@tranchled.com